你可以把你这幅图里标题上'thin die'理解为形容词，理解成’thin die'版STIM。而按你的理解，'thin'是来形容STIM的，但是这个理解和实际不符。这是宣传物料，语法没有那么严谨，但结合示意图和海外媒体的报导都可以知道这次10代钎焊U的die是变薄了的
第八、第九代 Core 系列，開發代號「Coffee Lake-S」，由 14nm++ 製程生產。今次第十代 Core 提升至 14nm+++，改善內部電晶體結構及佈綫質素，也應用「Thin Die STIM」(Thin Die Solder Thermal Interface Material) 新設計。核心晶片 (Die) 厚度縮減，也即是薄了，但水平面積加大，藉此增加熱力傳導面積。同時，表面 IHS (Integrated Heat Spreader) 金屬散熱蓋則加厚。Die 與 IHS 之間，以焊接方式接合，達到最大熱力傳導效率。
https://ezone.ulifestyle.com.hk/article/2632248/Intel%20%E5%8D%81%E4%BB%A3%20Core%20%E6%AD%A3%E5%BC%8F%E7%99%BB%E5%A0%B4%EF%BC%81%E6%9C%80%E9%AB%98%2010%20%E6%A0%B8%E5%BF%83%E2%80%A75.3GHz%20Turbo%20%E6%99%82%E8%84%88
Intel also said that it is making the die thinner while also increasing the thickness of the IHS to allow for better thermal performance. Intel didn't delve much about this in the presentation, but we managed to gather a few details pertaining to the use of soldered thermal interface material (STIM) in CML-S.
https://www.notebookcheck.net/10-cores-and-5-3-GHz-Intel-possibly-hits-the-limits-of-the-Skylake-architecture-with-the-new-10th-gen-Comet-Lake-S-for-desktop.463229.0.html
|
