本帖最后由 jasu30 于 2016-3-27 17:27 编辑
结合目前的新闻信息：
More to come on our afternoon news, about the next AM4 Socket and Summit Ridge. The AM4 Socket will be 40 x 40 mm, like Fm2+ Socket, and the mounting hole pitches seem to be 54mm and 90mm (measured between the center of the holes, of course).
About Summit Ridge, the first revision of this CPU seems to support just DDR4-2400 MHz, and DRR4-2933 MHz when overclocked. These are conservative values, so we can image that AMD has used a standard IMC designed by Synopsys in order to save some money (See AMD-Synopsys agreement) during the design phase. Due to low DDR4 bandwidth, we will probably see Zen APUs with HBM On Package.
Future AMD AM4 Socket will be µOPGA, and it will have 1331 pins. A LGA solution will be used for Opteron Zen CPUs. AM4 solution will have the virtue of putting together the plus points of the three actual AMD sockets: AM3+, FM2+ and AM1. Like AM3+ Socket, AM4 will be able to support 140+ Watt CPUs and APUs. Like FM2+, AM4 will be able to support powerful integrated GPUs. Like AM1, AM4 will allow to realize budget mainboards, as much as high end mainboards: AM4 CPUs and APUs will have an integrated FCH, but a lot of features can be added thanks to external chipsets (more PCI-E lines for multi GPUs cofigurations, M.2 slots, etc). According to our sources, AMD will produce the next APUs based on Zen uArch at GloFo FABs, with the 14nm FinFET node. Amkor will be apponited for the packaging, because of HBMs use. It seems that AMD has chosen the duo GloFo-Amkor, instead of TSMC-Amkor, thanks to the good and reliable alliance of these two companies.
可以基本猜测：
1、AM4依旧是AMD老传统的OPGA（CPU底面针脚）方式，不会采用Intel那种LGA封装，针脚数量达到史无前例的1331针（之前AM2/3系列才940左右；FM1/2系列大约905左右；最早AMD采用LGA封装的U是Opteron，06年用于服务器的Socket F/1207），因为CPU基板还是4x4cm，针脚数提升近400，导致每根针脚距离更近，针脚本身更细，这也就是传说中的新µOPGA封装了。
2、全新接口能够支持140+W的Zen CPU或者APU（FX-9590表示AM3+可以轻松挑战220+W），也是第一次AMD将CPU和APU的接口统一，CPU内部集成北桥功能，然后集成的内存控制器只支持DDR4，主板只剩南桥（FM系列早这么做了，AM系列已经停滞更新好些年，AM1那Atom性能的废物请无视）。实际上这更像是Intel Conroe（Core 2 Duo/Quad，LGA 775）到Nehalem/Westmere（LGA 1156）的那种变化，不管CPU有没集成显卡，完成了接口统一。
3、CPU基板大小没变、封装方式没变，但费解的是AM4散热器安装基座的孔距发生了改变，96x48变为90x54，我个人认为原装/类原装安装方式的老散热器是可以继续使用的，某些报道也是表明了最近新出的静音+信仰灯的Wraith就是Zen未来的御用散热器。只要Zen本身给力，换个散热扣具神马的都不是事，我们有无所不能的首富家~
4、AM4的Zen CPU和APU，以及Polaris（北极星）新架构的GPU都将使用前“女友”的14nm FinFET（这主要还得感谢三大棒子的倾情帮助，不然GF的32nm SOI HKMG可再战10年）。前女友回来了，小三台鸡店就被无情抛弃了（小台不哭你还有老黄）。。
5、据称4月发布新显卡，10月能看到Zen CPU。
最后上一个LGA封装的AMD Opteron图（1331的AM4要比这1207还要密集）。。
那种背面完全木有电容只有触点的手感。。摸起来滑溜溜的感觉比Intel CPU爽多了。。。唉！！！（CPU只买散片的我又得用银行卡掰针脚去了）
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